ASUS P6T Series Features New Intel X58 Chipset for Intel i7

With the release of the new Intel X58 platform imminent, ASUS has consolidated plans around the P6T Series of motherboards. Specifically designed to provide outstanding performance that caters to increasing user needs, the ASUS P6T Deluxe motherboard will fully embrace the new Intel platform; and touches on several significant changes in terms of key components like the CPU socket, chipset and DIMM channels. With such a big leap in terms of technology, the P6T Deluxe will be slated to provide faster bandwidth, storage and enhance overall performance – allowing users to look forward to experiencing extreme overclocking performance.

The Coming New Intel Platform
The first obvious change on the P6T Deluxe is the migration of the chipset to the new Intel X58+ICH10R. This successor to the X48 chipset features support for 36 lanes – making it possible for 4 PCI-E x16 slots to run at x8 modes. This chipset evolution will also match Intel’s new CPU generation – the Nehalem family, and allow users to utilize 1366-pin Bloomfield CPUs with core frequencies of 2.66GHz, 2.93GHz and 3.2GHz (the very first Nehalem members in market). The memory controller will be integrated to support 3-channel (6 DIMMs) DDR3 1333 for the CPU; while the L3 cache is expected to reach up to the 8MB mark. The new generation of CPUs will support memory of up to 24GB with a total bandwidth of 3200MB/s; and differing from the X48, this new platform exclusively supports DDR3. What’s even more exciting is the fact that this new platform will adopt a new system bus structure – QPI (QuickPath Interconnect) which supports up to 6.4GT/s (3.2GHz) and a max bandwidth of up to 25.6GB/s (twice the bandwidth compared to current FSB 1600 standards). With such high specification standards, the P6T Deluxe truly looks set to unleash the ultimate in performance for hardcore PC users.

SAS Support for Server-level Storage
To match the supreme performance of the new platform, the ASUS P6T Deluxe will adopt the SAS (Serial Attached SCSI) controller to let users utilize SAS hard disks. These hard disks will provide higher data transmission speeds and better data storage reliability in comparison to current SATA interfaces; and could herald the start of a new standard for mainstream storage devices that caters to enterprise users. With this technological improvement, users will be able to connect 2 SAS hard disks to the P6T Deluxe without the need to purchase an extra SAS controller card. Performance-wise, an SAS hard disk gains a 39% improvement on PC Mark HDD Test benchmarks when comparing RAID 0 performances with SATA (supported by SB ICH10R) interfaces.

Real Power, Real Savings with 16-Phase Power Design
The P6T Deluxe adopts ASUS’ revolutionary 16-phase power design, and utilizes real hardware power regulation to guarantee genuine power efficiency and increased power efficiency. With this industry-leading design, the P6T Deluxe draws less power, operates at lower temperatures and delivers excellent performance – making the whole system more stable, and thus extends the life spans of key components such as the CPU and motherboard.

P6T Deluxe with DTS Proprietary Algorithms for Clear, Immersive Audio
The P6T Deluxe, much like selected ASUS Home Theater PCs, will utilize DTS SURROUND SENSATION ULTRAPC TECHNOLOGY* with proprietary DTS algorithms to provide professional level surround and cinema sounds. Able to create a center and rear channels even on two speakers or headphones, the P6T Deluxe with DTS SURROUND SENSATION ULTRAPC TECHNOLOGY will allow the listener to perceive sounds as if surrounded by audio from all sides for a fully immersive audio experience.

The DTS proprietary algorithms include: Dialog Clarity, which solves the problem of unintelligible dialog usually found in home theater environments through enhanced signal clarity; LFE Mixing, which mixes existing bass channel content into left and right stereo channels to allows users to obtain superb bass effects – even on two speakers or just headphones; and Bass Enhancement, which improves bass performance by utilizing proprietary psychoacoustic techniques to restore the perception of fundamental low-frequency tones – without the additional hardware costs of adding a subwoofer.

*DTS technologies are subject to product specifications and may require a driver update.

ASUS Rampage Extreme Motherboard

ASUS has for some time now had a very successful run with their Republic Of Gamer (ROG) motherboards, which started with quite humble beginnings and the Commando. Since then, the ROG brand has grown from strength to strength in the endeavour of providing the best hardware engineering; the fastest performance and innovation for PC enthusiasts the world over. ASUS' ROG motherboards could be considered the epitomy of a well rounded, high performing platform upon which to base your high-end system.

Today we have been fortunate enough to have been given the opportunity to review the X48-based ASUS Rampage Extreme, which is the latest offering from ASUS marketed towards the performance user or overclocking enthusiast. In fact, the ASUS Rampage Extreme is "Designed for overclockers" according to the manufacturer and if first impressions are anything to go by then I agree wholeheartedly.

Before we begin the review let's take a moment to consider what kind of images that the name Rampage Extreme conjures up...
According to the Meriam Webster Online Dictionary it defines Rampage as: a course of violent, riotous, or reckless action or behavior. Woohoo I'm interested already :D

And Extreme is defined as: a very pronounced or excessive degree.

Summing up the name 'Rampage Extreme' we can now settle with the knowledge that this motherboard should provide us with an overclocking experience to the 'enth degree. And if that's the case then sign me up and strap me in!

Swiftech Releases Apogee GTZ Processor Water Block

It's been awhile since something new and interesting was released on the watercooling front. But today watercooling king Swiftech is introducing Apogee GTZ, the company's new flagship water-block for processors.

Apogee GTZ outperforms both its Apogee GT and Apogee GTX predecessors, thanks to an entirely new design that pushes and refines both thermal and mechanical specifications to the limits of today's technology.

The new Apogee GTZ combines the benefits of direct coolant impingement over the CPU area with an entirely new CNC machined C110 copper base plate design which is primarily characterized by a pin matrix composed of 225 µm (0.009") micro structures.

This results in a 20% improvement in thermal resistance compared to the Apogee GTX. In real world, a comparison chart shows that when used to cool an overclocked to 3500MHz C2Q6600 processor with 1.5V, Apogee GTZ beats Apogee GTX with 8'C. By default Apogee GTZ is compatible with LGA775 sockets only, but for $9.95 you can purchase optional hold-down plates for Socket 603/604, 771, Socket 754, 939, 940, F and Socket AM2.

The Apogee GTZ water-block sells for $69.95.

NVIDIA Intros New Quadro Fx Notebook Family of Graphics Cards

Demand for better graphics performance and programmability within the professional notebook market continues to increase as animators, designers and engineers work with larger 3D models, datasets and images. NVIDIA Corporation, the worldwide leader in visual computing technologies, continues to address the demand with the introduction of a new series of NVIDIA Quadro FX mobile GPUs, featuring an NVIDIA CUDA Parallel Computing Processor. Leading workstation manufacturers such as Dell, Fujitsu Siemens Computers, HP and Lenovo are now offering the new series of Quadro FX mobile GPUs across a wide range of professional notebook workstations.

Highlighting the flagship product of the series is the Quadro FX 3700M, with 128 CUDA Parallel Computing Processor cores, which offers an unprecedented 1 GB of dedicated graphics memory for graphics-performance hungry industries such as oil and gas exploration, mechanical design and digital content creation. Now, the power of a desktop workstation is available in a compact, notebook configuration.

"Design professionals who rely on the performance and features of a desktop workstation can now get this same level of performance in a notebook," said Jeff Brown, general manager, Professional Solutions, NVIDIA. "With the new Quadro FX 3700M visual computing solution, the notebook becomes a powerful workstation, allowing professionals to work anywhere, at any time, without sacrificing graphics quality or performance."

Engineered to deliver high-performance visualization of large datasets with extremely high image quality in an ISV-certified notebook platform, these notebooks also feature:

Up to 1 GB GDDR3 memory
Up to 256-bit memory interface
Up to 51.2 GBps graphic memory bandwidth
OpenGL 2.1, Shader Model 4.0, and DirectX 10
PowerMizer 8.0 adaptive power management tools

Additionally, the Quadro FX 2700M GPU, with 48 CUDA Parallel Computing Processor cores and 512 MB of GDDR3 memory, is an ideal graphics solution for 17-inch notebook platforms targeting high-end design and content-creation applications. The Quadro FX 1700M GPU with 32 CUDA Parallel Computing Processor cores, the Quadro FX 770M GPU with 32 CUDA Parallel Computing Processor cores, and the Quadro FX 370M GPU with 8 CUDA Parallel Computing Processor cores, are designed for 15.4-inch and 14.1-inch notebooks, which help round out the new Intel Centrino II-based platforms.

The complete line of NVIDIA Quadro FX notebook solutions is available worldwide through leading notebook manufacturers and workstation system integrators.

Intel Unveils Extensible Host Controller Interface Draft Spec to Support USB 3.0

Intel Corporation today announced the availability of the Extensible Host Controller Interface (xHCI) draft specification revision 0.9 in support of the USB 3.0 architecture, also known as SuperSpeed USB. The xHCI draft specification provides a standardized method for USB 3.0 host controllers to communicate with the USB 3.0 software stack.


Interoperability among devices from multiple manufacturers is important for consumer adoption of SuperSpeed USB products. The Intel xHCI draft specification revision 0.9 supports compatibility among various implementations of USB devices and will make it easier to develop software support for the industry.

This specification describes the registers and data structures used to interface between system software and the hardware, and are developed to be compatible with the USB 3.0 specification being developed by the USB 3.0 Promoter Group. The Intel xHCI draft specification revision 0.9 is being made available under RAND-Z (royalty free) licensing terms to all USB 3.0 Promoter Group and contributor companies that sign an xHCI contributor agreement; information is available online from Intel Corporation at intel.com/technology/usb/spec.htm.

"The future of computing and consumer devices is increasingly visual and bandwidth intensive," said Phil Eisler, AMD corporate vice president and general manager of the Chipset Business Unit. "Lifestyles filled with HD media and digital audio demand quick and universal data transfer. USB 3.0 is an answer to the future bandwidth need of the PC platform. AMD believes strongly in open industry standards, and therefore is supporting a common xHCI specification."

"Dell welcomes the availability of Intel's xHCI specification because it provides a single interface standard that will expedite the industry transition to next-generation USB 3.0," said Rick Schuckle, client architecture strategist. "This interface standard is important to ensure that our customers have interoperable USB 3.0 systems, devices and software drivers."

"Microsoft has developed driver support for the USB industry standard since its inception and is committed to supporting the latest hardware technologies on the Windows platform," said Chuck Chan, Microsoft general manager of Windows Core OS. "Microsoft intends to deliver Windows support for hardware that is compliant with the xHCI specification; this is a huge step forward in enabling the industry and our customers to easily connect SuperSpeed USB devices to their PCs for exciting new functionality and usages."

"NEC Electronics has supported Intel's EHCI specification for USB 2.0 and WHCI specification for Wireless USB 1.0, and developed solutions based on both of these standards," said Hiroshi Iguchi, NEC Electronics vice president of its 2nd SOC Operations Unit. "NEC Electronics will now provide USB 3.0 solutions based on Intel's xHCI specification to ensure interoperability of our solution with multiple products from various manufacturers. As we have done for USB 2.0, NEC Electronics would like to lead the USB 3.0 market with our discrete USB 3.0 host controller."

Intel plans to make available a revised xHCI 0.95 specification in the fourth quarter. The updated revision of the specification will also be released under RAND-Z licensing terms via an xHCI adopter's agreement.